SRAM uses bistable latching circuitry to store each bit. While no refresh is necessary it is still volatile in the sense that data is lost when the memory is not powered. A typical SRAM uses 6 MOSFETs to store each memory bit although additional transistors may become necessary at smaller nodes. Fig 1. Simplified block... » read more| Semiconductor Engineering
ANSYS develops specialized system-level simulation technology for a variety of industries.| Semiconductor Engineering
Discrete unpackaged die that can be assembled into a package with other chiplets; each chiplet is optimized to its function.| Semiconductor Engineering
High-bandwidth memory (HBM) is standardized stacked memory technology that provides very wide channels for data, both within the stack and between the memory and logic. An HBM stack can contain up to eight DRAM modules, which are connected by two channels per module. Current implementations include up to four chips, which is roughly the equivalent... » read more| Semiconductor Engineering
Published 8/23/2021 (by Mark LaPedus & Ed Sperling). . “Inside Intel’s Ambitious Roadmap” article link is here. Ann Kelleher, senior vice president and general manager of Technology Development at Intel, sat down with Semiconductor Engineering to talk about the company’s new logic roadmap, as well as lithography, packaging, and process technology. What follows are excerpts of... » read more| Semiconductor Engineering
Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.| Semiconductor Engineering
