Selecting the right PCB laminates and materials for your design is very important as it can impact the overall performance of the board.| Sierra Circuits
Download the HDI PCB Design Guide which provides tons of guidelines for blind and buried via technology.| Sierra Circuits
Sequential lamination is a process of fabricating a high-density PCB using cores and subsets composed of copper and dielectric layers.| Sierra Circuits
Staggered and stacked vias play crucial role in designing HDI boards. The compact design is highly functional with great signal integrity.| Sierra Circuits
Drilling is the most expensive and time-consuming process in PCB manufacturing. A small fault in the drilling process leads to a great loss.| Sierra Circuits
Vias are miniature conductive pathways drilled into the PCB to establish electrical connectivity between the different layers.| Sierra Circuits
EMI can be mitigated by incorporating efficient grounding techniques and optimum trace spacing. This also ensures EMC.| Sierra Circuits