AMD’s Zen 6 processors will take a massive leap in process technology, skipping TSMC’s 3nm-class node for the successive 2nm offerings. This rumor-confirmation comes from @Kepler_L2 on the AnandTech forums, stating that much of the Zen 6 portfolio will be fabbed on TSMC’s N2P node, including: Add Hardware Times as a preferred source for the …| Hardware Times
Intel’s next-gen Nova Lake-S CPU die has allegedly taped out. In other words, the first fabricated dies have arrived from the fab for testing and quality control. The interesting part is that the tape-out comes from TSMC’s 2nm-class manufacturing, making Nova Lake-S the second “Core Ultra” desktop lineup using third-party capacity. Increased Reliance on TSMC; …| Hardware Times