By Tetsu Ho With the ever-increasing global demand for smarter, faster electronic systems, the semiconductor industry faces a dual challenge: delivering high-performance memory while reducing environmental impact. Winbond is meeting this challenge head-on by embedding sustainability into every layer of its operations—from green manufacturing processes to low-power memory innovations designed for AI, automotive, and industrial…| Semiwiki
Much of advanced technology is data-driven. From the cloud and AI accelerators to automotive processing and edge computing, data storage and transmission efficiency are of critical importance. It turns out that lossless data compression is a key ingredient to deliver these requirements. While there are both software and hardware solutions, hardware-based approaches offer the best…| Semiwiki
AI’s exponential growth is transforming semiconductor design—and memory is now as critical as compute. Multi-die architecture has emerged as the new frontier, and custom High Bandwidth Memory (cHBM) is fast becoming a cornerstone in this evolution. In a panel session at the Synopsys Executive Forum, leaders from AWS, Marvell, Samsung, SK Hynix, and Synopsys discussed…| Semiwiki
