Self-contained liquid cooling: the low-friction option - Uptime Institute Blog
Each new generation of server silicon is pushing traditional data center air cooling closer to its operational limits. In 2025, the thermal design power (TDP) of top-bin CPUs reached 500 W, and server chip product roadmaps indicate further escalation in pursuit of higher performance. To handle these high-powered chips, more IT organizations are considering direct […]| Uptime Institute Blog
