Broad-line supplier of EDA, IP and software testing tools.| Semiconductor Engineering
Discrete unpackaged die that can be assembled into a package with other chiplets; each chiplet is optimized to its function.| Semiconductor Engineering
High-bandwidth memory (HBM) is standardized stacked memory technology that provides very wide channels for data, both within the stack and between the memory and logic. An HBM stack can contain up to eight DRAM modules, which are connected by two channels per module. Current implementations include up to four chips, which is roughly the equivalent... » read more| Semiconductor Engineering