Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-package. While putting multiple chips in a package has been around for decades, the driver for advanced packaging is directly correlated with Moore’s Law. Wires are shrinking along with transistors, and the amount of distance that... » read more| Semiconductor Engineering
Extreme ultraviolet (EUV) lithography is a soft X-ray technology, which has a wavelength of 13.5nm. Today’s EUV scanners enable resolutions down to 22nm half-pitch. In a system, an EUV light source makes use of a high power laser to create a plasma. This, in turn, helps emit a short wavelength light inside a vacuum chamber.... » read more| Semiconductor Engineering
Gate-all-around FET (GAA FET) is a modified transistor structure where the gate contacts the channel from all sides. It’s basically a silicon nanowire with a gate going around it. In some cases, the gate-all-around FET could have InGaAs or other III-V materials in the channels. Introduced by major foundries around the 3nm/2nm nodes when further scaling... » read more| Semiconductor Engineering
A field programmable gate array (FPGA) is a semiconductor device than can take on the personality of a customer’s design by programming it. Unlike a processor that executes a program, and FPGA configures itself to become an operating circuit that will then respond to inputs in the same way that a dedicated piece of hardware... » read more| Semiconductor Engineering
