Two or more integrated circuit dies that are stacked on top of each other. The access mechanism connects only to the bottom die. The classic definition that has emerged for 3D ICs is logic on logic, connected with through-silicon vias (TSV). But there are other iterations of this idea, ranging from package-on-package (PoP), homogeneous memory... » read more| Semiconductor Engineering
2.5D is a packaging methodology for including multiple die inside the same package The approach typically has been used for applications where performance and low power are critical. Communication between chips is accomplished using either a silicon or organic interposer, typically a chip or layer with through-silicon vias for communication. While communication between chips is... » read more| Semiconductor Engineering
Arm is a developer of a wide variety of IP including processor cores, graphics, and physical IP. One of Arm’s focuses is energy-efficient processor designs. Executive Insight: Simon Segars ARM’s CEO talks about the next five years, the opportunities surrounding the IoT, security, interconnects, and microservers. HQ: Cambridge, UK Known For: IP Other names: Arm... » read more| Semiconductor Engineering
Broad-line supplier of EDA, IP and software testing tools.| Semiconductor Engineering
Mentor, a Siemens Business, is a broad line EDA supplier. It provides a complete semiconductor design flow that includes simulation, emulation, place and route, verification, design for manufacturing, and test. It also develops tools for wire harness systems and computational fluid dynamics.| Semiconductor Engineering
A full line EDA supplier| Semiconductor Engineering
ANSYS develops specialized system-level simulation technology for a variety of industries.| Semiconductor Engineering
Discrete unpackaged die that can be assembled into a package with other chiplets; each chiplet is optimized to its function.| Semiconductor Engineering
Published 8/23/2021 (by Mark LaPedus & Ed Sperling). “Inside Intel’s Ambitious Roadmap” article link is here. Ann Kelleher, senior vice president and general manager of Technology Development at Intel, sat down with Semiconductor Engineering to talk about the company’s new logic roadmap, as well as lithography, packaging, and process technology. What follows are excerpts of... » read more| Semiconductor Engineering
