The CHIPS for America NSTC Prototyping and National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Piloting Facility (PPF), an NSTC and NAPMP facility, is expected to be located the Arizona State University (ASU) Research Park in Tempe, Arizona| NIST
The CHIPS for America Design and Collaboration Facility (DCF), an NSTC Facility, is expected to operate in Sunnyvale, California. The proposed facility will play an important role in advancing semiconductor design research, workforce development, investment, and collaboration across the entire semic| NIST