A hybrid stackup is built using a combination of dielectric materials to improve the PCB's performance and cost-effectiveness.| Sierra Circuits
IPC-2221 is a standard that lays down the requirements for material selection, component placement, and high-voltage spacing requirements.| Sierra Circuits
When choosing HDI PCB material, consider the operating frequency, acceptable signal loss, and laser drilling compatibility.| Sierra Circuits
A multilayer PCB has more than two layers in its stack-up. The stack-up describes the construction of a multilayer board in sequential order.| Sierra Circuits
To build an efficient PCB stack-up, select the right materials, estimate the number of signal layers, and optimally arrange the layers.| Sierra Circuits
Design strategies for reliable microvias include selecting laser drillable materials and adhering to IPC-T-50M and IPC-2226 standards.| Sierra Circuits
Staggered and stacked vias play crucial role in designing HDI boards. The compact design is highly functional with great signal integrity.| Sierra Circuits
When designing humanoid robotics PCBs, use high-frequency materials and incorporate FPCs to integrate sensors.| Sierra Circuits
To get your first PCB manufactured, design your board, select a manufacturer, perform DFM and DFA analysis, and place the order.| Sierra Circuits
This case study focuses on the challenges and solutions that we implemented to design complex HDI boards with stacked vias.| Sierra Circuits