Selecting the right PCBs for IC integration depends on the chip’s signal characteristics, power demands, and the end-product.| Sierra Circuits
Via filling helps to build a reliable PCB by improving electrical conductivity, thermal dissipation, and mechanical strength of a via.| Sierra Circuits
Design strategies for reliable microvias include selecting laser drillable materials and adhering to IPC-T-50M and IPC-2226 standards.| Sierra Circuits
Sequential lamination is a process of fabricating a high-density PCB using cores and subsets composed of copper and dielectric layers.| Sierra Circuits
Staggered and stacked vias play crucial role in designing HDI boards. The compact design is highly functional with great signal integrity.| Sierra Circuits
This case study focuses on the challenges and solutions that we implemented to design complex HDI boards with stacked vias.| Sierra Circuits