The Intel 4 process achieves 20% better performance and scales logic density by 2X while reducing costs through extensive design co-optimization, adoption of new materials, and judicious use of EUV lithography. The first product, the Meteor Lake compute tile, will ramp to high volume manufacturing in 2023.| Real World Tech
Intel's 22FFL (FinFET Low-power) is a variant of their existing 22nm process that is aimed at low-cost, extremely low-power, and analog/RF applications. 22FFL relaxes the ground rules to reduce the need for double patterning, thereby cutting costs. At the same time, Intel’s engineers essentially backported the second and third generation FinFETs from the 10nm and 14nm processes to 22FFL, improving performance and power efficiency with superior fin geometry and workfunction metals. Intel als...| Real World Tech