I’m designing a 2-layer PCB where the top layer is densely packed with through-hole and surface-mount components, while the bottom layer has minimal routing. From an EMI/EMC perspective, which ground plane strategy would be theoretically optimal: Ground plane (copper pour) on the top layer only Ground plane (copper pour) on the bottom layer only Ground planes on both layers with stitching vias I believe option 2 might be superior since it provides low-impedance return paths and minim...| SierraConnect