Teledyne HiRel Semiconductors is pleased to announce the release of their industrial-grade embedded MultiMediaCard (eMMC) module. Featuring 128GB of eMMC 5.1-compliant storage in a compact 153-ball FBGA package, this device is engineered to deliver reliable, high-speed performance in harsh environments. Qualified over the industrial temperature range of –40°C to +85°C, this eMMC module is well-suited for […] The post Teledyne HiRel Semiconductors Launches eMMC 5.1 Module appeared...| Circuit Cellar
This device offers low max RthJC of 0.36 °C/W and wettable flanks to improve thermal performance and solderability in industrial applications| Circuit Cellar
Artificial intelligence (AI) and machine learning (ML) have dramatically changed the industrial landscape, improving processes, outcomes and reliability. We’ve all heard how applications of AI and ML in manufacturing can improve quality, reduce accidents and enhance productivity. But what about the lesser-known ways these technologies support innovation and competitiveness? 1. Enabling Equipment Scheduling While AI-powered […]| TechTheLead