Alphawave UCIeTM Chiplet IP on TSMC 3DFabric® Platform
The chiplet provides 10x improvement in power efficiency and up to 5x increased signal density over traditional die-to-die interfaces.| Circuit Cellar
The chiplet provides 10x improvement in power efficiency and up to 5x increased signal density over traditional die-to-die interfaces.| Circuit Cellar
A new technical paper titled “Leveraging Chiplet-Locality for Efficient Memory Mapping in Multi-Chip Module GPUs” was published by researchers at Electronics and Telecommunications Research Institute (ETRI) and Sungkyunkwan University. Abstract “While the multi-chip module (MCM) design allows GPUs to scale compute and memory capabilities through multi-chip integration, it introduces memory system non-uniformity, particularly when a... » read more The post Utilizing Chiplet-Locality For...| Semiconductor Engineering
