By Ujjwal Negi – Siemens EDA Multi-die architectures are redefining the limits of chip performance and scalability through the integration of multiple dies into a single package to deliver unprecedented computing power, flexibility, and efficiency. At the heart of this transformation is the Universal Chiplet Interconnect… Read More The post Smart Verification for Complex UCIe Multi-Die Architectures appeared first on SemiWiki.| SemiWiki
Catch mistakes early, confirm exceptions are used correctly, and ensure constraints involve in step with the RTL.| Semiconductor Engineering