Digital in-memory compute chip startup d-Matrix has a new 3D stacking memory technology (3DIMC) promising to run AI models 10x faster and slash energy use by up to 90 percent compared to the current industry standard, HBM4. The firm was founded in 2019 by CEO Sid Sheth and CTO Sudeep Bhoja, both executives at high-speed […]| Blocks and Files
The first portion of this report will explain HBM, the manufacturing process, dynamics between vendors, KVCache offload, disaggregated prefill decode, and wide / high-rank EP. The rest of the repor…| SemiAnalysis
Delve into the details of the collaboration between NVIDIA and SK Hynix. Learn about their joint pursuits.| Govindhtech
SK Hynix Inc., the world’s No. 2 memory chipmaker, began mass-producing HBM3E, the best-performing DRAM chip for AI applications, for the first time in t| KED Global
Samsung Electronics Co. and SK Hynix Inc. – the world’s two largest memory chipmakers – have fiercely competed to advance their chip stacking| KED Global
Alphawave Semi has collaborated with Arm on the development of an advanced compute chiplet based on Arm’s Neoverse compute subsystems.| Tech Design Forum