The economics associated with current AI development do not add up. Lots of money is spent, but little money is earned. The post AI Effort And Money Misplaced appeared first on Semiconductor Engineering.| Semiconductor Engineering
From node selection to choice of interconnect, multi-die system designers face a myriad of decisions. The post Chiplet Design Considerations appeared first on Semiconductor Engineering.| Semiconductor Engineering
Validate FEC performance in a wide variety of real application scenarios prior to widespread deployment. The post Programmable Hardware Delivers 10,000X Improvement In Verification Speed Over Software For Forward Error Correction appeared first on Semiconductor Engineering.| Semiconductor Engineering
By profiling systems early, designers can address fundamental issues in data flow and resource coordination.| Semiconductor Engineering
3D-IC trends and challenges; virtual prototypes for SDVs; chiplet security; sustainable AI development; quality best practices.| Semiconductor Engineering