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Imec cleans up process for 2µm-pitch 3DIC stacks
https://www.techdesignforums.com/blog/2024/05/29/imec-ectc-2%c2%b5m-pitch-3dic-stacks/
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Tagged with:
ip
bonded wafers
silicon photonics
3dic
wafer bonding
Imec has developed cleaner techniques for preparing die-to-wafer bonding components for high-density logic-memory stacks and optical integration.
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