Thermal Design Power (TDP) has long been a data center thermal management cornerstone. However, in recent years, its limitations have become increasingly apparent. As chip power densities continue to soar, TDP’s ability to accurately predict cooling requirements has been scrutinized. Download our whitepaper, “Future-Proof Your Data Center Cooling with GRC’s iDLC Technology” to learn more. The Limitations of TDP TDP … The post The Trouble with TDP: Rethinking Data Center Cooling appe...