In his keynote at the TSMC OIP Ecosystem Forum Dr. LC Lu, TSMC Senior Fellow and Vice President, Research & Development / Design & Technology Platform, highlighted the exponential rise in power demand driven by AI proliferation. AI is embedding itself everywhere, from hyperscale data centers to edge devices, fueling… Read More The post TSMC’s Push for Energy-Efficient AI: Innovations in Logic and Packaging appeared first on SemiWiki.
