Custom thermoelectric devices, faster prototypes, and reliable U.S. manufacturing for critical industries. Sheetak Inc., a U.S.-based leader in advanced thermoelectrics, is redefining solid-state cooling and energy management with fully customizable devices and rapid prototyping through its expanded U.S. manufacturing capabilities. […] The post Sheetak Strengthens U.S. Thermoelectric Manufacturing with Custom Solutions and Rapid Prototyping appeared first on Electronics Cooling.| Electronics Cooling
Rosenberg’s new generation of Ecofit G9 EC motors offers an increased power rating of 170 watts, providing a higher-performance, more energy-efficient air movement solution. The new motor is available on 48 models of Ecofit backward-curved fans and forward-curved blowers. They provide improved ventilation […]| Electronics Cooling
Author’s note: This article was initially published in a compilation of some of the articles published in the Electronics Cooling Magazine ‘Statistics Corner’ [4]. However, it was never published as part of a standard ECM issue. Therefore, it seemed appropriate […] The post Statistics Corner: Modifying Sample Size appeared first on Electronics Cooling.| Electronics Cooling
Introduction A transient thermal characterization, also known as a thermal survey, aims to characterize the location of greatest thermal inertia within a hardware system—that is, the location with the slowest temperature response to a given environmental stimulus. This manuscript outlines […]| Electronics Cooling
Archives for 2025| Electronics Cooling
Introduction Thermal management plays a critical role in the performance, reliability, and longevity of wearable devices. Reliability must be considered even when components remain below their absolute maximum operating temperatures. This is due to increased diffusion rates, material fatigue, and […]| Electronics Cooling
In today’s technological landscape, the demand for high performance computing continues to soar, driven by advances in artificial intelligence, data analytics, and complex simulations. As processors become more powerful, there has been a rise in the power draw of the […] The post Direct Liquid Cooling for High-Compute Servers appeared first on Electronics Cooling.| Electronics Cooling
By Navid Kazem, Lieven Vervecken, and Claire Wemp The SEMI-THERM 41 Symposium was held March 10-13, 2025 at the Double Tree Hotel in San Jose, CA. Program organization was led by General Chair Lieven Vervecken (Diabatix), Program Chair Dr. Navid […] The post Summary of SEMI-THERM 41 Conference appeared first on Electronics Cooling.| Electronics Cooling
Electric vehicles (EVs) and hybrid vehicles (HEVs & PHEVs) are becoming increasingly prevalent to reduce the environmental detriments produced by traditional combustion engine (ICE) vehicles. The use of stored electrical energy as opposed to stored chemical energy (gas) requires the […]| Electronics Cooling
Alloy Enterprises, a manufacturing company revolutionizing data center cooling with its novel Stack Forging™ process, today introduced a new copper direct liquid cooling (DLC) solution. As chip power densities and thermal design power rise—pushing AI server rack power densities beyond […] The post Alloy Enterprises Unveils Copper Direct Liquid Cooling, Slashing AI Data Center Energy Use and Eliminating the Need for HVAC appeared first on Electronics Cooling.| Electronics Cooling
Adding to its innovative ‘ApX Series’ range of cooling infrastructure for hyperscale and edge data centres, LFB Group has launched its brand new Fan Wall Unit (FWU) – a high-performance, modular solution built to meet the fast-evolving demands of modern […] The post Data Centre Solutions Division From LFB Group Launches Lennox Branded Fan Wall appeared first on Electronics Cooling.| Electronics Cooling
Tesla Tear Down, CFD Validation, and Machine Learning to Determine the Performance Limit This study investigates the hydraulic and thermal characteristics of the TESLA AUTOPILOT HW2.5 MODEL 3 Y, which features a double-sided cold plate with PCBs attached on both […]| Electronics Cooling
Analyze solder fatigue in BGA packages to uncover the effects of thermal expansion and temperature variations on performance.| Electronics Cooling
Rjc (or sometimes ThetaJC, θjc, Rth_jc), the so-called ‘junction to case’ thermal resistance, is a thermal metric that enables comparison of the thermal performance of packaged semiconductor devices from differing suppliers. The JEDEC standard JESD51-14 [1] documents a method for […]| Electronics Cooling
The aerospace, electronic, and optical industries often involve environments where outgassing from adhesives can pose significant challenges. When exposed to vacuum or elevated temperatures, conventional adhesives may release volatile compounds, leading to contamination or performance degradation of sensitive components. To […]| Electronics Cooling
Lance Dumigan Fabrisonic, LLC Mark Norfolk Fabrisonic, LLC Practical Knowledge Gained “The performance of DTC cold plates can be enhanced by a new method of fabrication called Ultrasonic Additive Manufacturing (UAM). Building DTC cold plates with UAM could enhance […]| Electronics Cooling
