BGA: Features, Soldering, and X-Ray Inspection | Sierra Circuits
The BGA is the most popular package used in high I/O devices in the industry. It has a high lead (solder ball) count which is greater than 208 leads.| Sierra Circuits
The BGA is the most popular package used in high I/O devices in the industry. It has a high lead (solder ball) count which is greater than 208 leads.| Sierra Circuits
Laser drilling is performed to drill holes and vias on a PCB using a laser beam without compromising the board integrity.| Sierra Circuits
An annular ring is the copper area surrounding a plated via on a PCB. It establishes a solid connection between the via and copper traces.| Sierra Circuits
Sierra Circuits offers quickturn, high-quality, HDI printed circuit boards. Learn about our HDI PCB capabilities.| Sierra Circuits
Design strategies for reliable microvias include selecting laser drillable materials and adhering to IPC-T-50M and IPC-2226 standards.| Sierra Circuits
Sequential lamination is a process of fabricating a high-density PCB using cores and subsets composed of copper and dielectric layers.| Sierra Circuits
Signal integrity is the measurement of a signal’s quality when it propagates from the transmitter to the receiver in an electronic system.| Sierra Circuits
This case study focuses on the challenges and solutions that we implemented to design complex HDI boards with stacked vias.| Sierra Circuits
Vias are miniature conductive pathways drilled into the PCB to establish electrical connectivity between the different layers.| Sierra Circuits
Parasitic capacitance effect in PCBs results in EMI and crosstalk. It can be reduced by following good layout practices.| Sierra Circuits
EMI can be mitigated by incorporating efficient grounding techniques and optimum trace spacing. This also ensures EMC.| Sierra Circuits
