Login
From:
Sierra Circuits
(Uncensored)
subscribe
BGA: Features, Soldering, and X-Ray Inspection | Sierra Circuits
https://www.protoexpress.com/blog/bga-features-soldering-x-ray-inspection/
links
backlinks
Roast topics
Find topics
Find it!
The BGA is the most popular package used in high I/O devices in the industry. It has a high lead (solder ball) count which is greater than 208 leads.
