IPC-2221 is a standard that lays down the requirements for material selection, component placement, and high-voltage spacing requirements.| Sierra Circuits
The BGA is the most popular package used in high I/O devices in the industry. It has a high lead (solder ball) count which is greater than 208 leads.| Sierra Circuits
Learn about how thermal management techniques and thermal vias in PCB are essential to minimize heating issues and boost thermal performance.| Sierra Circuits
Download the Design for Manufacturing Handbook and learn the best design practices for your electronics in terms of both cost and complexity.| Sierra Circuits
FR4 materials are widely used due to their cost-effectiveness, wide range of operating temperatures, and excellent thermal properties.| Sierra Circuits
To build an efficient PCB stack-up, select the right materials, estimate the number of signal layers, and optimally arrange the layers.| Sierra Circuits
Signal integrity is the measurement of a signal’s quality when it propagates from the transmitter to the receiver in an electronic system.| Sierra Circuits
PCB fabrication considerations for proper component placement are essential to improve the signal quality and performance of your device.| Sierra Circuits
Vias are miniature conductive pathways drilled into the PCB to establish electrical connectivity between the different layers.| Sierra Circuits
The Trace Width, Current, and Temperature Rise Calculator helps you compute conductor width, current capacity, and temperature above ambient.| Sierra Circuits