3.5D: The Great Compromise
Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.| Semiconductor Engineering
Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.| Semiconductor Engineering
AI and robotics are taking on bigger, more complex, and increasingly autonomous tasks, but integration with existing equipment and processes remains a formidable challenge.| Semiconductor Engineering
