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Semiconductor Engineering
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3.5D: The Great Compromise
https://semiengineering.com/3-5d-the-great-compromise/
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Tagged with:
manufacturing
special reports
ansys
advanced packaging
amkor
2.5d
3.5d
3d-ic
Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.
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