3.5D: The Great Compromise
Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.| Semiconductor Engineering
More analysis and more data are needed to predict how different dies will interact in the same package. The post Thermal, Mechanical, And Material Stresses Grow With Die Stacking appeared first on Semiconductor Engineering.| Semiconductor Engineering
Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.| Semiconductor Engineering
