By Ujjwal Negi – Siemens EDA Multi-die architectures are redefining the limits of chip performance and scalability through the integration of multiple dies into a single package to deliver unprecedented computing power, flexibility, and efficiency. At the heart of this transformation is the Universal Chiplet Interconnect… Read More The post Smart Verification for Complex UCIe Multi-Die Architectures appeared first on SemiWiki.| SemiWiki
Alphawave Semi has collaborated with Arm on the development of an advanced compute chiplet based on Arm’s Neoverse compute subsystems.| Tech Design Forum
The flat nature of traditional IC packaging design struggles to cope with the chiplet era. Homogeneous disaggregation offers an alternative.| Tech Design Forum