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Putting chiplet design on the ‘smart path’
https://www.techdesignforums.com/blog/2024/04/15/putting-chiplet-design-on-the-smart-path/
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Tagged with:
case study
packaging
ppa
chiplet
next generation design
design flow
floorplanning
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The flat nature of traditional IC packaging design struggles to cope with the chiplet era. Homogeneous disaggregation offers an alternative.
