Teledyne HiRel Semiconductors is pleased to announce the release of their industrial-grade embedded MultiMediaCard (eMMC) module. Featuring 128GB of eMMC 5.1-compliant storage in a compact 153-ball FBGA package, this device is engineered to deliver reliable, high-speed performance in harsh environments. Qualified over the industrial temperature range of –40°C to +85°C, this eMMC module is well-suited for […] The post Teledyne HiRel Semiconductors Launches eMMC 5.1 Module appeared...
