Bunch of Wires (BoW) is a chiplet interconnect specification developed by the Open Compute Project Foundation Open Domain-Specific Architecture (ODSA) project. It defines a versatile, open, and interoperable physical interface between two chiplets or chip-scale-packages (CSP) in a common package. The ODSA die-to-die (D2D) communication architecture consists of: A protocol layer that defines communication between... » read more
