The post Applied Materials Q3 FY 2025 Results Show Solid Quarterly Performance Overshadowed by China and Outlook Concerns appeared first on Futurum. Ray Wang, Research Director at Futurum, shares insights on Applied Materials Q3 FY 2025: record revenue and EPS with 48.9% gross margin, and a Q4 outlook below consensus on China digestion and non-linear leading-edge demand. The post Applied Materials Q3 FY 2025 Results Show Solid Quarterly Performance Overshadowed by China and Outlook Concerns a...| Futurum
The post Will Applied Materials Meet Expectations in the AI Capex Boom? appeared first on Futurum. Insights on assessing Applied Materials’ Q3 2025 outlook amid AI-driven HBM demand and advanced packaging momentum. The post Will Applied Materials Meet Expectations in the AI Capex Boom? appeared first on Futurum.| Futurum
From node selection to choice of interconnect, multi-die system designers face a myriad of decisions. The post Chiplet Design Considerations appeared first on Semiconductor Engineering.| Semiconductor Engineering
Next-generation optical inspection is about more than just sensitivity. It’s about reliably seeing through complexity.| Semiconductor Engineering
ECTC progress report on enabling technologies, including cooling chiplets, 1µm hybrid bonding, RDL buildups, and co-packaged optics.| Semiconductor Engineering
Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.| Semiconductor Engineering
This year’s ECTC, held at the end of May, will continue its focus on the role of packaging in keeping silicon scaling on track.| Tech Design Forum