3.5D: The Great Compromise
Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.| Semiconductor Engineering
Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.| Semiconductor Engineering
This year’s ECTC, held at the end of May, will continue its focus on the role of packaging in keeping silicon scaling on track.| Tech Design Forum
