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Dense packaging focus for ECTC
https://www.techdesignforums.com/blog/2024/05/13/dense-packaging-focus-for-ectc/
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Tagged with:
iot
embedded
hpc
eda
advanced packaging
3dic
sensor hub
This year’s ECTC, held at the end of May, will continue its focus on the role of packaging in keeping silicon scaling on track.
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